美国协调关税表（HTSUS） › 第 84 章 核反应堆、锅炉、机器、机械器具及其零件
8486.10.00.00税号详情
归类路径
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(C) to this chapter; parts and accessories
8486
Machines and apparatus for the manufacture of boules or wafers
8486.10.00.00
税率
- 普通税率（第 1 栏）
- Free
- 特殊税率
- —
- 第 2 栏
- 35%
- 单位
- No.
- 印本页码
- 2862
措施提示按原产国 CN
- 对华 301 清单 L29903.88.02 · 25%；豁免：9903.88.70（Silicon growth furnaces, including Czochralski crystal growth furnaces, designed for growing monocrystalline silicon ingots (boules) of a mass exceeding 700 kg, for use in solar wafer manufacturing，至 2026-11-09）；9903.88.70（Band saws designed for cutting or slicing cylindrical monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into square or rectangular ingots (boules), for use in solar wafer manufacturing，至 2026-11-09）；9903.88.70（Machines designed to align and adhere square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 200 kg to plastic support boards on metal mounting plates to provide support during diamond wire sawing, for use in solar wafer manufacturing，至 2026-11-09）；9903.88.70（Diamond wire saws designed for cutting or slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers，至 2026-11-09）；9903.88.70（Wire guide roller machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing，至 2026-11-09）；9903.88.70（Coolant fluid recycling machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing，至 2026-11-09）；9903.88.70（Degumming machines designed to remove adhesives from solar wafers，至 2026-11-09）
- 强迫劳动 301：在豁免清单9903.05.86 · note 52(b)