Harmonized Tariff Schedule of the U.S. › Chapter 84 Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof
8486.10.00.00Tariff line
Classification path
Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays; machines and apparatus specified in note 11(C) to this chapter; parts and accessories
8486
Machines and apparatus for the manufacture of boules or wafers
8486.10.00.00
Rates of duty
- General rate (Column 1)
- Free
- Special
- —
- Column 2
- 35%
- Unit
- No.
- Printed page
- 2862
Measure flagsfor origin CN
- Section 301 China, L29903.88.02 · 25%; exclusion: 9903.88.70 (Silicon growth furnaces, including Czochralski crystal growth furnaces, designed for growing monocrystalline silicon ingots (boules) of a mass exceeding 700 kg, for use in solar wafer manufacturing, until 2026-11-09); 9903.88.70 (Band saws designed for cutting or slicing cylindrical monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into square or rectangular ingots (boules), for use in solar wafer manufacturing, until 2026-11-09); 9903.88.70 (Machines designed to align and adhere square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 200 kg to plastic support boards on metal mounting plates to provide support during diamond wire sawing, for use in solar wafer manufacturing, until 2026-11-09); 9903.88.70 (Diamond wire saws designed for cutting or slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, until 2026-11-09); 9903.88.70 (Wire guide roller machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing, until 2026-11-09); 9903.88.70 (Coolant fluid recycling machines, presented with diamond wire saws designed for slicing square or rectangular monocrystalline silicon ingots (boules) of an initial mass exceeding 400 kg into solar wafers of a thickness not exceeding 200 micrometers, all of the foregoing for use in solar wafer manufacturing, until 2026-11-09); 9903.88.70 (Degumming machines designed to remove adhesives from solar wafers, until 2026-11-09)
- Section 301 forced labor: on an exemption list9903.05.86 · note 52(b)